BACK
Wafer size : up to 8 inch
Multi layer film analysis
동시 분석 film thickness and composition
Multi point measurement
20원소 동시 측정
GEM 대응
반도체용 형광 X-선 분석장치 Wafer/Disk Analyzer 3650
Wafer size : up to 8 inch
Multi layer film analysis
동시 분석 film thickness and composition
Multi point measurement
20원소 동시 측정
GEM 대응
반도체용 형광 X-선 분석장치
Wafer/Disk Analyzer 3650
Product Features
제품특징
Wafer/Disk Analyzer 3650
Wafer size : up to 8 inch
Multi layer film analysis
동시 분석 film thickness and composition
Multi point measurement
20원소 동시 측정
GEM 대응
- 분석 원소: 4Be~92U
- 200mm까지의 반도체 공정용
- BPSG, Wsix, 강유전체막(PZT, BST등의 두께 및 조성등의 동시 분석
- BPSG, SiO2, Si3N4, Doped polySi(B, P, N, As), Wsix, Al-Cu, TiW, TiN, TaN, PZT, BST, SBT, MRAM 등
- 금속막: W, Mo, Ti, Co, Ni, Al, Cu, Ir, Pt, Ru 등
- 자기 디스크: CoCrTa, CoCrPt, DLC, NiP 등
- 광학 자기 디스크: Tb-FeCo 등
- 자기 헤드: GMR, TMR 등
Specifications
제품사양
| Specifications | ||
| Sample size | Max 8" | |
| Simultaneous analysis elements | Fixed type Max 20 elements | |
| Scan type Heavy element (22Ti ~ 92U) | ||
| Aperture | Selectable 4 kinds out of 5, 10, 15, 20, 40mm diameter | |
| X-ray tube | Rh target, Max 4kW | |
| Detector | S-PC, SC, F-PC (PR gas rquired for F-PC) | |
| Sample stage | XYθ stage | |
| Analysis spot designation | r, θ designation, r : 1mm step, θ : 1˚ step | |
| Sample spin mechanism | 6rpm (available only for wafer center analysis | |
| availble up to 8" wafer | ||
| C-to-C (option) | Orientation flat / V-notch alignment available | |
| Vacuum pump | Dry pump | |
| Stabilizing system | Temperature stabilizer, Automatic vacuum control system | |
| Data processing system | Personal computer, windows 7 | |
| Software | ||
| Film thickness / Concentration simultaneous analysis software | ||
| Fundamental Parameter software for thin film analysis | ||
| Mapping software (option) | ||
| On-line analysis program(option) | Complies with GEM | |
| Safety standard | Complies with SEMI S2-0310, CE Marking (option) | |
| Others | SMIF, Through-the-wall, can be met according to a preliminary meeting | |
