BACK
The 4Wave ion beam sputtering cluster tool has maintained 4Wave’s 95% market share
in the Vanadium Oxide Processing community (MEMS Market)
이온빔 스퍼터 장비 Ion Beam Sputtering Cluster Tool
The 4Wave ion beam sputtering cluster tool has maintained 4Wave’s 95% market share
in the Vanadium Oxide Processing community (MEMS Market)
이온빔 스퍼터 장비
Ion Beam Sputtering Cluster Tool
Product Features
제품특징
Ion Beam Sputtering Cluster Tool
- Markets Include -
Semi-Conductor
MEMS
Data Storage
Optics
Wafer processing services
- Applications -
Thermal Imaging
EUV Mask
Magnetic Tunnel Junctions
Specifications
제품사양
| Specifications | ||
| Ion Beam Sputtering Cluster Tool | Low Energy Gridless Plasma Source | |
| Ion Assisted deposition (Gridless or Gridded Source) | ||
| Hollow Cathode Electron Source | ||
| 6 x 8″ or 3 x 12″ or 2 x 16 “biased target carousel | ||
| Pulse DC target from 1Hz to 250Khz up to -1300V | ||
| Up to 200mm diameter process surface | ||
| <3% non-uniformity | ||
| Closed loop control of film properties | ||
| Substrate plasma cleaning, etching oxidation, nitridation | ||
| Water cooled, tilting, rotating, magnetic shuttered stage | ||
| Robotically loaded, optically aligned wafers | ||
| Load lock with up to 25 wafers | ||
| RF Gridded Plasma Source | ||
| Ion Assisted deposition (Gridless or Gridded Source) | ||
| Plasma Bridge Electron Source | ||
| 6 x 8″ or 3 x 12″ or 2 x 16″ target carousel | ||
| Up to 200mm diameter process surface | ||
| <3% non-uniformity | ||
| Closed loop control of film properties | ||
| Substrate plasma cleaning, etching oxidation, nitridation | ||
| Water cooled, tilting, rotating, magnetic shuttered stage | ||
| Robotically loaded, optically aligned wafers | ||
| Load lock with up to 25 wafers | ||
Video
관련영상
